INFINEON TECHNOLOGIES AMERICAS CORP.
Patent Owner
Stats
- 268 US PATENTS IN FORCE
- 22 US APPLICATIONS PENDING
- Mar 20, 2018 most recent publication
Details
- 268 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 3,333 Total Citation Count
- Dec 14, 2000 Earliest Filing
- 64 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2018/0054,120 POWER CONVERTER WITH AT LEAST FIVE ELECTRICAL CONNECTIONS ON A SIDEAug 22, 16Feb 22, 18[H03K, H02M]
2017/0365,595 Schottky Integrated High Voltage Terminations and Related HVIC ApplicationsJun 17, 16Dec 21, 17[H01L]
2017/0338,171 Semiconductor Package Including Flip Chip Mounted IC and Vertically Integrated InductorMay 20, 16Nov 23, 17[H01L]
2017/0271,445 Bipolar Semiconductor Device Having Localized Enhancement RegionsMar 18, 16Sep 21, 17[H01L]
2017/0271,487 Bipolar Semiconductor Device with Sub-Cathode Enhancement RegionsMar 18, 16Sep 21, 17[H01L]
2017/0187,230 Rectification and Regulation Circuit for a Wireless Power ReceiverMar 10, 17Jun 29, 17[H02J]
2017/0032,958 Method for Cleaning Hermetic Semiconductor PackagesMay 18, 16Feb 02, 17[B24C, H01L, B08B]
2016/0199,613 COMPRESSIBLE RESPIRATORY THERAPY HOSE AND COLLECTING ROD FOR STORAGEAug 17, 14Jul 14, 16[A61M]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9923409 Rectification and regulation circuit for a wireless power receiverMar 10, 17Mar 20, 18[H02J]
9911600 Fabrication of semiconductor device using alternating high and low temperature layersOct 08, 15Mar 06, 18[H01L, C30B]
9911679 Semiconductor package with integrated output inductor on a printed circuit boardFeb 06, 17Mar 06, 18[H01L, H01F, H05K]
9911720 Power switch packaging with pre-formed electrical connections for connecting inductor to one or more transistorsAug 19, 16Mar 06, 18[H01L]
9899302 Semiconductor package having multi-phase power inverter with internal temperature sensorMay 17, 17Feb 20, 18[H01L]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2016/0211,337 III-Nitride Transistor with Solderable Front MetalAbandonedMar 29, 16Jul 21, 16[H01L, H02M]
2016/0172,284 Integrated Power Assembly with Stacked Individually Packaged Power DevicesAbandonedNov 11, 15Jun 16, 16[H01L]
2016/0172,353 III-Nitride Switching Device with an Emulated DiodeAbandonedFeb 09, 16Jun 16, 16[H01L]
2016/0020,279 Edge Termination Using Guard Rings Between Recessed Field Oxide RegionsAbandonedJul 02, 15Jan 21, 16[H01L]
2016/0005,816 Group III-V Transistor with Voltage Controlled SubstrateAbandonedJun 08, 15Jan 07, 16[H01L]
2016/0005,821 Group III-V Lateral Transistor with Backside ContactAbandonedJun 08, 15Jan 07, 16[H01L]
2016/0005,845 Group III-V Transistor Utilizing a Substrate Having a Dielectrically-Filled RegionAbandonedJun 08, 15Jan 07, 16[H01L]
2015/0371,987 Group III-V HEMT Having a Diode Controlled SubstrateAbandonedJun 02, 15Dec 24, 15[H01L]
2015/0357,182 Fabrication of III-Nitride Power Semiconductor DeviceAbandonedAug 20, 15Dec 10, 15[H01L]
2015/0348,888 Semiconductor Package with Integrated Heat SpreaderAbandonedAug 13, 15Dec 03, 15[H01L]
2015/0325,685 Power Semiconductor Device with Low RDSON and High Breakdown VoltageAbandonedApr 13, 15Nov 12, 15[H01L]
2015/0162,832 Group III-V Voltage Converter with Monolithically Integrated Level Shifter, High Side Driver, and High Side Power SwitchAbandonedNov 26, 14Jun 11, 15[H02M, H01L]
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